Passive Cooling Structural System — Bio-Inspired Design
15–20%
vs. conventional panels
Conventional solid-wall structural panels rely on active cooling, adding weight, power, and maintenance burden to enclosure and electronics applications.
Design an integrated structural and passive thermal system using bio-inspired airflow channels that eliminates active cooling while maintaining load-bearing capacity.
Developed a channel architecture combining structural, ventilation, and thermal regulation functions. Applied 1D numerical heat transfer analysis to size geometry, characterize thermal resistance, and optimize heat flux distribution.
Estimated 15–20% thermal performance improvement vs. conventional solid-wall panels (benchmarked against published bio-inspired cooling data). Demonstrated systems-level thermal-structural co-design applicable to lightweight enclosures and electronics.